Hanmi - Dicing Saws

Wafer micro SAW Innovation

HANMI showcased their latest micro SAW W1121α at the recent Semicon Korea Exhibition. This full-automation micro SAW for wafer cutting is a standalone 12-inch model that cuts wafers attached to tapes. In this innovative machine, HANMI has leveraged their 42-years of know-how in the semiconductor industry to create a product that delivers precision processing, vision and setting technology.

JFP Microtechnic

Microelectronic Back-End Production Equipment

JFP MICROTECHNIC manufactures a broad range of microelectronic assembly and support equipment that works perfectly from prototyping to production. Die Bonders, Wire Bonders, Waffle Pack Loaders, Laser Bar Stacking / Testing, and accessories. If you're not finding what you're looking for, JFP Microtechnic also entertains building custom equipment to meet your needs.

Kulicke & Soffa

#1 Worldwide in Ball & Wedge, Plus Wafer Wire Bonders
#1 in Advanced Packaging Equipment

KULICKE & SOFFA's flagship product, the Rapid Pro Ball bonder is #1 worldwide with 65% - 75% Market Share, Quarter to Quarter, year after year. This semiconductor bonder has extended capabilities that make it the wire bonding choice for complex devices from microwave, RF, multichip modules, optoelectronic laser packaging, etc.. K&S also has major offerings in Heavy Wire Wedge and Ribbon Bonding, Dispensing, Die Transfer, Flip-Chip, TCB, Electronic Assembly. CONSUMABLES include Ball Bonding Capillaries, Wedge Bonding Consumables, and Dicing Blades.

LFG Micro

Custom Dage 4000 Pull Hooks
- Dage 4000 / BT-22 Custom Hooks for Wire & Ribbon Pull Test

Gold Bonding Wire IN STOCK!
- 20µm, 25µm, 30µm diameter wire BY THE SPOOL!

K&S 4500 & 5000 Service & Training
- 4100 / 4500 / 5000 Series Preventive Maintenance, Repairs, and Operator Training.
Short Run Package De-lidding & Re-Seal Consultant
- Midas Technology short run Package Delidding. Hermetic Package Re-Seal Consulting

Midas Technology

Hermetic Package Delidder
Hot Gas Component Removal

MIDAS TECHNOLOGY has the only mass produced delidder, making it #1! in the world.
Applications: 4-sided seam sealed or Au/Sn reflow lids.

NanoFEA

Custom Engineered Getter Materials
Traditional Getter Materials
Hermetic Package Lid / Getter Assemblies
RGA Testing Services

NANOFEA custom designs Getter Materials and offers industry standard formulations as well. ALL getters have moisture control standard. Broad spectrum, targeted gas/moisture, particles and VOCs. NANOFEA can also supply getters pre-assembled inside and onto hermetic package sealing lids.

Stellar Industries

AlO2, AlN, & BeO Metalized Ceramic Substrates
All-Cu & DBC Micro-Channel Liquid Coolers

STELLAR INDUSTRIES offers custom build-to-print, thermally conductive metalized ceramics for any application, Al₂O₃ , AlN, BeO included. They also design and manufacture build-to-print micro-channel liquid coolers for maximum heat dissipation.

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