Kulicke & Soffa Table Top Wire Bonder Service, Hands-On Training, Parts & Supplies
USA based, we offer both phone and video support for all K&S 4522, 4523, 4524, 4526 and 5000 ball and wedge wire bonder models. If we’re unable to resolve your issues over the phone we’ll need to come to you, or your bonder will need to come to us.
Outside of the DC-to-Boston travel corridor your lowest cost option will always be to send it here under our all inclusive flat rate labor rate (parts additional).
4500 series bonders were discontinued in 2013 but they are still highly reliable and fully maintainable wire bonders.
The K&S table top wire bonders are all volume production workhorses responsible for many company’s entire manufacturing efforts.
The 5000 ball and wedge models were designed and introduced by K&S in 2013. The 5000 is an all digital, PC based, using a 7″ touch screen for parameter entry and storage. The 5000 series wire bonders were the last table top wire bonder models manufactured by K&S.
What steel is to cities is what Indium Corp products are to microelectronics and electronics assemblies. The full complement of solders, fluxes, eutectics, braze materials, TIMs, and Ignitors in shapes and configurations that cover countless industries, attach and heat dissipation applications.
The WB200-E table-top wire bonder comes in a manual/semi-automatic version but easily expands to full Auto-Bond. A fully motorized x/y table with a true Z bonding head uses a true Z video camera for precise on screen targeting of your 1st and 2nd wire bonds. This makes for an extremely low-skill set capable of making FINE Pitch wire bonds. Set up the wire feed, calibrate your capillary to the camera, and now you can simply scroll and click on your 1st and 2nd bond locations and this bonder will automatically complete your wire. You have full control over loop profile creation in any direction. Plus the bonder comes with bumping and deep access wedge bonding too!
Trying to make fine pitch bond placements with a traditional microscope-only wire bonder simply can’t compete. Contact us today for a datasheet and pricing.
JFP has many other smart and advanced microelectronic offerings including die bonders, die sorters, wafer scribers, and even laser diode and laser bar mounters and stackers. Please make an inquiry for more.
Kulicke & Soffa
Connections, specifically Interconnections. Microelectronic wire bonding these days is incredibly fast, at its lowest price point ever, reaching a reliability level never achieved before! Complimented by automated die bonding, flip chip, TCB die attach or incorporated into the most capable cross-over SMT Pick & Place systems available today.
Mission Critical Microelectronic Rework dominance. The ability to remove hermetic package lids inside a cleanroom, without introducing metal particulate into the cavity, is why Midas Delidders are industry standard.
The ability to remove both eutectic and epoxy mounted components and substrates from microelectronic modules makes Midas Technology the industry standard for in-package rework. A lower cost Single Jet Hot Gas system is geared more toward epoxies while the dual jet system is capable of removing Au/Sn eutectically bonded components and larger epoxy mounted components and substrates.
Tanaka Bonding Wire
The largest supplier in the world for microelectronic bonding wire. We carry stock of both Al and Au bonding wire on half inch and 2″ spools.
We also supply manufacturing lines with just-in-time wire deliveries to keep their onsite inventory low with 6-10 day deliveries ARO or to schedule.
Tanaka provides our customers with an exceptional experience from purchasing through delivery, incoming inspection, and online performance.